Diamond Slurry for SiC Wafer or Sapphire Wafer Lapping or Polishing +86-15039091808

Diamond Slurry for Lapping Silicon Carbide 

This product is mainly used for coarse grinding and thinning of silicon carbide wafers.

Special requirements can be tailor-made.

(1)The product is matched with cast iron plate to achieve high material removal rate meanwhile ensure the quality of silicon carbide wafer (Warp, bow, TTV);

(2)The product has good anti-rust performance;

(3)The product possesses stable suspension of diamond abrasives, and there is no obvious settlement phenomenon when placed for a long time;

(4)Strict quality control to ensure the consistency and stability of product quality. 

This product is mainly used for lapping and polishing of silicon carbide wafers.

Special requirements can be tailor-made.

(1)The product is matched with a special silicon carbide Lapping pad to achieve high removal rate and improve efficiency;

(2)High surface quality of the silicon carbide wafer after lapping processing (roughness, scratch, sub-surface damage layer and other parameters);

(3)Water-soluble carrier formula with good cleaning performance;

(4)Stable suspension;

(5)Compared with conventional water-based formula, the product has better lubrication performance.